Dual Band Siw Patch Antenna Based on H-Slotted Dgs for Ku Band Application

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Date

2020

Journal Title

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Volume Title

Publisher

Institute of Electrical and Electronics Engineers Inc.

Open Access Color

Green Open Access

No

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Yes
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Top 10%
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Top 10%
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Top 10%

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Abstract

A dual band Substrate Integrated Waveguide; SIW microstrip patch antenna based on periodic H-Defected Ground Structure; H-DGS is designed for Ku band applications. SIW techniques provide low cost, small size and convenient integration with planer circuit. The proposed antenna structure is designed on a Roger 5058 substrate with a thickness of 1.6 mm, 2.2 of dielectric constant and tangent loss of 0.0009. The performance analysis of the proposed antennas is performed using finite element methods, and the simulation results show a gain and directivity of 7.03 dB and 7.38 dB respectively at 12.67 GHz center frequency and at 14.56 GHz a gain of 7.77 dB and directivity of 8.13 dB. The proposed antenna overall radiation efficiency is 95.25% and 95.60% at 12.67 GHz and 14.56 GHz, respectively. The obtained measurements show good agreement with the simulation results. The proposed antenna is compact, simple in structure, and can be used in a variety of applications in the Ku band. © 2020 IEEE.

Description

7th International Conference on Electrical and Electronics Engineering, ICEEE 2020 -- 14 April 2020 through 16 April 2020 -- 160450

Keywords

Defected Ground Structure, Finite Element Method, Ku-Band, Microstrip Patch Antenna, Satellite application, Substrate Integrated Waveguide (SIW), Defected ground structures, Microstrip antennas, Slot antennas, Substrate integrated waveguides, Substrates, Antenna structures, Center frequency, Dual Band, Low costs, Micro-strip patch antennas, Performance analysis, Radiation efficiency, Tangent loss, Microwave antennas

Fields of Science

0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology

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12

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2020 7th International Conference on Electrical and Electronics Engineering, ICEEE 2020

Volume

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Start Page

194

End Page

197
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